채용 문의:
서치펌 HR네트워크 상무 John Park
010-7459-0442
nhpark22@gmail.com (가급적 문자나 메일로 문의해 주시기 바랍니다.)
010-7459-0442
nhpark22@gmail.com (가급적 문자나 메일로 문의해 주시기 바랍니다.)
반도체 Failure Analysis Engineer in Quality Management
자격조건 * +5years’ experience as failure analysis engineer
* Bachelor degree above in electronics, electric or semiconductor engineering major
* Power device(ex, IGBT, MOSFET) FA experience is preferred.
* Basic knowledge about ESD and EOS
* Know-how on semiconductor failure analysis is preferred.
* Good understanding of automotive semiconductor function is preferred.
* Good understanding of failure analysis electrically, physically
* Good understanding of front end/back end process
* Good skill in speaking / writing in English
* Basic knowledge of maintaining FA equipment
* Understanding quality system
담당업무 * Handle manual FA works and using FA equipment & maintenance
* Support physical failure analysis for customer return : Visual inspection with low, high microscope, X-ray, SAM(Scanning Acoustic Microscopy, SEM/EDX, IR-LIT(Infrared Lock-In-Thermography), Chemical de-capsulation, Laser de-capsulation, Die level analysis
* Support electrical analysis with ATE/ bench test for device function
* Prepare 8D report based on FA analysis results
자격조건 * +5years’ experience as failure analysis engineer
* Bachelor degree above in electronics, electric or semiconductor engineering major
* Power device(ex, IGBT, MOSFET) FA experience is preferred.
* Basic knowledge about ESD and EOS
* Know-how on semiconductor failure analysis is preferred.
* Good understanding of automotive semiconductor function is preferred.
* Good understanding of failure analysis electrically, physically
* Good understanding of front end/back end process
* Good skill in speaking / writing in English
* Basic knowledge of maintaining FA equipment
* Understanding quality system
담당업무 * Handle manual FA works and using FA equipment & maintenance
* Support physical failure analysis for customer return : Visual inspection with low, high microscope, X-ray, SAM(Scanning Acoustic Microscopy, SEM/EDX, IR-LIT(Infrared Lock-In-Thermography), Chemical de-capsulation, Laser de-capsulation, Die level analysis
* Support electrical analysis with ATE/ bench test for device function
* Prepare 8D report based on FA analysis results
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